ON SEMICONDUCTOR CORP (ON) [Rocket]

Type	Name	Date
Indenture	Indenture, among the Company, the guarantors party thereto and Wells Fargo Bank, National Association	05/19/2021
Indenture	Indenture, among the Company, the guarantors party thereto and Wells Fargo Bank, National Association	08/21/2020
Indenture	Indenture, among the Company, the guarantors party thereto and Wells Fargo Bank, National Association	08/21/2020
Credit agreement	Fifth Amendment to Credit Agreement, by and among ON Semiconductor, as borrower, the subsidiary guarantors party thereto, Deutsche Bank AG New York Branch, as administrative agent, collateral agent and issuing lender, the 2019 Incremental Revolving Lenders and the New Required Lenders party thereto	06/17/2019
Credit agreement	Fifth Amendment to Credit Agreement, by and among ON Semiconductor, as borrower, the subsidiary guarantors party thereto, Deutsche Bank AG New York Branch, as administrative agent, collateral agent and issuing lender, the 2019 Incremental Revolving Lenders and the New Required Lenders party thereto	06/17/2019
Credit agreement	Amendment No. 3, to Credit Agreement, by and among the Company, the guarantors party thereto, Deutsche Bank AG New York Branch, as administrative agent, and the several lenders party thereto	12/04/2017
Credit agreement	Amendment No. 3, to Credit Agreement, by and among the Company, the guarantors party thereto, Deutsche Bank AG New York Branch, as administrative agent, and the several lenders party thereto	12/04/2017
Credit agreement	Amendment No. 2, to Credit Agreement, by and among the Company, the guarantors party thereto, Deutsche Bank AG New York Branch, as administrative agent, and the several lenders party thereto	04/03/2017
Indenture	Indenture, among the Company, the guarantors party thereto and Wells Fargo Bank, National Association	04/03/2017
Credit agreement	First Amendment to Credit Agreement, among ON Semiconductor Corporation, as borrower, certain subsidiaries thereof, as guarantors, the several lenders party thereto, and Deutsche Bank AG, New York Branch, as administrative agent and collateral agent	09/30/2016
Indenture	Second Supplemental Indenture, among ON Semiconductor Corporation, the guarantors party thereto and Wells Fargo Bank, National Associate, as trustee	04/15/2016
Indenture	Second Supplemental Indenture, among ON Semiconductor Corporation, the guarantors party thereto and Deutsche Bank Trust Companies Americas, as trustee	04/15/2016
Indenture	Supplemental Indenture, among ON Semiconductor Corporation, the guarantors party thereto and Wells Fargo Bank, National Associate, as trustee	03/17/2016
Indenture	Supplemental Indenture, among ON Semiconductor Corporation, the guarantors party thereto and Deutsche Bank Trust Companies Americas, as trustee	03/17/2016
Indenture	Indenture, among the Company, the guarantors party thereto and Wells Fargo Bank, National Association	06/08/2015
Credit agreement	Amendment No. 2, to Amended and Restated Credit Agreement, by and among the Company, Semiconductor Components Industries, LLC, the lenders party thereto and JPMorgan Chase Bank, N.A., as administrative agent	06/03/2015
Credit agreement	Amended and Restated Credit Agreement, by and among ON Semiconductor Corporation, Semiconductor Components Industries, LLC, the lenders party thereto, JPMorgan Chase Bank, N.A., as Administrative Agent, and the other parties thereto, as amended by Amendment No. 1 thereto	05/04/2015
Credit agreement	Amended and Restated Credit Agreement, by and among ON Semiconductor Corporation, Semiconductor Components Industries, LLC, the lenders party thereto, JPMorgan Chase Bank, N.A., as Administrative Agent, and the other parties thereto, as amended by Amendment No. 1 thereto	05/04/2015
Indenture	Indenture among the Company, the Subsidiary Guarantors and Deutsche Bank Trust Company Americas, as Trustee	12/19/2011