6-K 1 tsm-6k_20221206.htm 6-K tsm-6k_20221206.htm

 

 

 

 

 

 

 

 

 

 

 

 

1934 Act Registration No. 1-14700

 

 

 

 

 

 

UNITED STATES

SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

 

 

 

FORM 6-K

 

 

 

REPORT OF FOREIGN PRIVATE ISSUER
PURSUANT TO RULE 13a-16 OR 15d-16 UNDER
THE SECURITIES EXCHANGE ACT OF 1934

 

 

 

For the month of December 2022

(Commission File Number: 001-14700)

 

 

Taiwan Semiconductor Manufacturing Company Ltd.

(Translation of Registrant’s Name Into English)

 

 

 

No. 8, Li-Hsin Rd. 6,
Hsinchu Science Park,
Taiwan, R.O.C.
(Address of Principal Executive Offices)

 

 

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.
Form 20-F  ☒            Form 40-F  ☐

Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(1): ☐

Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(7): ☐

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 


 

 

 

 

SIGNATURES

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Taiwan Semiconductor Manufacturing Company Ltd.

Date:

December 6, 2022

By

/s/ Wendell Huang

 

 

 

 

Wendell Huang

 

 

 

 

Vice President & Chief Financial Officer

 


 


 

 

 

TSMC Announces Updates for TSMC Arizona

 

 

PHOENIX, Arizona, Dec. 6, 2022 – TSMC (TWSE: 2330, NYSE: TSM) today announced that

in addition to TSMC Arizona’s first fab, which is scheduled to begin production of N4 process

technology in 2024, TSMC has also started the construction of a second fab which is scheduled to

begin production of 3nm process technology in 2026. The overall investment for these two fabs

will be approximately US$40 billion, representing the largest foreign direct investment in Arizona

history and one of the largest foreign direct investments in the history of the United States.

 

In addition to the over 10,000 construction workers who helped with construction of the site,

TSMC Arizona’s two fabs are expected to create an additional 10,000 high-paying high-tech jobs,

including 4,500 direct TSMC jobs. When complete, TSMC Arizona’s two fabs will manufacture

over 600,000 wafers per year, with estimated end-product value of more than US$40 billion.

 

In line with TSMC’s commitment to green manufacturing, it was also revealed that TSMC Arizona

is in the planning stages for an on-site Industrial Water Reclamation Plant that when finished, will

allow the TSMC Arizona site to achieve near zero liquid discharge.

 

“When complete, TSMC Arizona aims be the greenest semiconductor manufacturing facility in the

United States producing the most advanced semiconductor process technology in the country,

enabling next generation high-performance and low-power computing products for years to come,”

said TSMC Chairman Dr. Mark Liu. “We are thankful for the continual collaboration that has

brought us here and are pleased to work with our partners in the United States to serve as a base

for semiconductor innovation.”

 

About TSMC

TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been

the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving

ecosystem of global customers and partners with the industry’s leading process technologies and

portfolio of design enablement solutions to unleash innovation for the global semiconductor

industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a

committed corporate citizen around the world.

 

TSMC deployed 291 distinct process technologies, and manufactured 12,302 products for 535

customers in 2021 by providing broadest range of advanced, specialty and advanced packaging

technology services. TSMC is the first foundry to provide 5-nanometer production capabilities, the

most advanced semiconductor process technology available in the world. The Company is

headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.


 

 

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TSMC Spokesperson:

 

Media Contacts:

 

 

 

 

Wendell Huang
Vice President and CFO
Tel: 886-3-505-5901

 

Nina Kao

Head of Public Relations

Tel: 886-3-5636688 ext.7125036

Mobile: 886-988-239-163

E-Mail: nina_kao@tsmc.com

 

Ulric Kelly

Public Relations

Tel: 886-3-5636688 ext.7126541

Mobile: 886-978-111-503

E-Mail: ukelly@tsmc.com