Type	Name	Date
Credit agreement	Credit Agreement among QUALCOMM Incorporated, the lenders party thereto, the letter of credit issuers party thereto and Bank of America, N.A., as administrative agent, swing line lender and a letter of credit issuer	12/10/2020
Registration rights agreement	Registration Rights Agreement	08/18/2020
Registration rights agreement	Registration Rights Agreement	06/05/2018
Credit agreement	AMENDMENT NO. 1 TO CREDIT AGREEMENT	04/24/2018
Credit agreement	CREDIT AGREEMENT	03/09/2018
Credit agreement	Credit Agreement among QUALCOMM Incorporated, the lenders party thereto and Goldman Sachs Bank USA, as Administrative Agent	11/09/2016
Credit agreement	Amended and Restated Credit Agreement among QUALCOMM Incorporated, the lenders party thereto and Bank of America, N.A., as Administrative Agent	11/09/2016
Indenture	Indenture, between the Company and U.S. Bank National Association, as trustee	05/21/2015
Credit agreement	Revolving Credit Agreement among Qualcomm Incorporated, the lenders party thereto and Bank of America, N.A., as Administrative Agent	02/18/2015